Partition materials based on wood particles and inorganic materials bonded with synthetic adhesives have a negative impact. The purpose of this study was to evaluate the manufacturing and characterization of particleboard as partition material using corn husk to substituted wood-based particles and water soluble chitosan (WSC) as adhesive to replaced synthetic-based adhesive. The WSC content was varied of 6%, 8% and 10% wt. The particleboards were manufactured under the pressure temperature variations of 160, 180 and 200 oC for 15 min, press pressure of 2.5 MPa and target density of 0.8 g/cm3. The physical and mechanical properties of particleboards improved in line with increasing WSC content up to 8% and pressure temperature above 160 oC. The value of MOR and MOE from boards bonded with WSC 8% and pressure temperature of 180 oC fulfilled the requirement of JIS A 5908 (2003). The sound absorption coefficient of particleboard bonded using WSC 6% was better than other boards. The particleboards absorbed sound at middle to high frequency ( > 1000 Hz) and reflected sound at low frequency (80 to 630 Hz). FTIR spectrum shows that the absorption area around 3400 cm-1 wavelengths is a little decrease in intensity due to with the increase of pressure temperature. Corn husk particleboard not yet classified as a heat insulator panel. This study suggest that corn husk is feasible to use for particleboard bonded using WSC adhesive as partition material.