In the current work, the utilisation of sunflower seed husk as a filler for epoxy composites is examined. Utilising the compression moulding technique, the composites were created with filler volumes ranging from 5% to 50%. Particle size distribution evaluations, elemental analyses, physico-chemical characteristics, X-ray diffraction, Fourier transform infrared spectroscopy, water absorption, and thermal stability of the composite were among the various characterizations that were carried out. Based on the results, Sample ID "SSH-5" demonstrated optimum water absorption behavior and thermal stability.